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Silicon Based Seeding of Electroless Metal Deposition Disclosure Number: IPCOM000040540D
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02

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Bindra, P Giess, EP Sullivan, EJ White, JR [+details]


Electroless plating baths require surface catalyzation of a plating object for acceptance of metal. This surface catalyzation can be accomplished in a single-step process that involves the surface adsorption of Pd/Sn alloy. Surfaces can be chemically treated to be receptive to uniform metal deposition from a variety of electroless plating solutions. A method for activating non-conducting surfaces by utilizing the concept of currentless metal deposition from metal ions in solution onto particulate or sputtered silicon is accomplished as follows. The energy level diagram for n- and p-type semiconductors and an electrolyte prior to contact is shown in the drawing, where the energy levels are described in volts vs. a reference electrode.