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Electronic Circuits-Preserving Technique for Decapsulating Plastic Packages Disclosure Number: IPCOM000040560D
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02

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Fenech, A [+details]


Because of their low cost and ease of use, plastic materials, such as epoxy resins, are increasingly employed for encapsulating integrated circuits. Decapsulating the plastic packages, without damaging the circuits embedded therein, is necessary whenever it is desired to access the circuits for failure analysis thereof. Most of the conventional techniques for decapsulating plastic packages call for the use of chemical, plastic-etching agents, such as nitric acid. The so-called "jet etch" technique is one of these. Not only does it require large volumes of nitric acid but, further, the nitric acid must be at a high temperature (about 250oC). As a result, the "jet etch" method is costly and its use involves operator safety problems.