Browse Prior Art Database

Solder Socket

IP.com Disclosure Number: IPCOM000040609D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Hamel, HC Lussow, RO Malaviya, SD [+details]

Abstract

Alignment of the optical fiber in an electro-optical chip holder assembly with either the optical source or detector is accomplished by means of the solder socket described in this article. Details of the disclosed solder socket are shown in Fig. 1. The socket assembly comprises a loose fitting pin 1 of approximately 30 mils outer diameter positioned within a hollow tube 2 in the manner shown in the drawing. The tube is approximately 60 mils inner diameter and 120 mils outer diameter, as indicated. The tube is bonded to the electro-optical carrier 3. Molten solder or another suitable conductive fixative, e.g., a conductive epoxy, is employed to obtain a permanent joining of the pin and tube together at the desired time. (Image Omitted) Application of the solder socket proceeds as shown in Fig. 2.