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Input/Output Extension for Staked or Brazed Pin Substrate

IP.com Disclosure Number: IPCOM000040612D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Ecker, ME Olson, LT [+details]

Abstract

A printed circuit card, or the like, is configured with insulated wire loops at specified locations to increase the input/output (I/O) capacity to a substrate without the need to drill additional holes in the card. The method is implemented in the following manner. (Image Omitted) The wire loops 1 (Fig. 1) are formed on the card 2 in the desired positions and immersed in a chemical bath 3 which strips an insulating layer 4 from the immersed end of the wire loops 1 to expose the copper 5 inside wire loop 1. The exposed copper wire 5 is then processed to provide an appropriate protective plating 6 (Fig. 2), such as Ni and a Pb/Sn alloy, for subsequent reflow bonding. As seen in Fig. 2, the card 2 with its wire loops 1 are registered for joining to a substrate 7.