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Browse Prior Art Database

Ball and Chip Placement Wafer

IP.com Disclosure Number: IPCOM000040615D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Burton, DW [+details]

Abstract

Placement of solder balls used in the interconnection of a ceramic chip and a circuitized substrate require a variety of placement devices and steps for the proper soldering of the chip wiring to the substrate. A flux or wax membrane which holds the solder balls or rings in the precise location for placement on a substrate pinhead eliminates the need for multiple placement operations. The membrane is constructed as seen in the drawing. The membrane is constructed of a material, e.g., wax, flux etc., such that it will dissipate when passed through the heat of a soldering unit when reflowing the solder to bond the solder balls to the circuitized substrate. The solder balls may be of any size and are placed in the desired position on the membrane to align the chip to the substrate.