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In-Situ Electroless Bath Take/Rate Monitor Disclosure Number: IPCOM000040632D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02

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Galasco, RT Reid, JD [+details]


Electroless plating bath deposition rates are vital in determining the plating time required to achieve a particular deposit thickness. The "take" time or the time required for the initiation of plating is also critical because it may vary depending on surface conditions and the seeding process conditions. Measuring techniques which depend on weight gain do not measure "take" and are not adaptable to in-situ monitoring. A test vehicle having exposed laminate in its central portion and copper at each end provides an accurate in-situ monitor of "take" and plating bath deposition rates.