Browse Prior Art Database

High-Density Memory Package

IP.com Disclosure Number: IPCOM000040634D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Funari, J Rivenburgh, DL [+details]

Abstract

A method of stacking high-density memory chips increases memory in an electronic package without any additional real estate requirements at the card level. The method of constructing the package is described in the following. (Image Omitted) The assembled package, seen in a cross-section view in Fig. 1, consists of a pair of substrates 1 which are placed in a cap 2 such that memory chips 3 face each other. The substrates 1 are joined to the chips 3 before placement in cap 2. The package assembly is complete when a jumper strap 4 is placed around the module and soldered in place. The package is assembled by shearing substrate pins 5 from one of the substrates and inserting the substrate into the cap 2 and securing by crimping (Fig. 2).