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ORGANIC ADDITIVE SYSTEM for ELECTRODEPOSITION of COPPER FROM ACID COPPER PLATING BATHS

IP.com Disclosure Number: IPCOM000040648D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
David, AP Reid, JD [+details]

Abstract

Electrodeposition of level, bright, and ductile copper deposits onto irregular conducting surfaces, using a range of current densities, is accomplished with an additive plating system which is described in the following. The additive mixture is a chemical composition selected from four classes of chemicals. The first class comprises certain water-soluble polymers which adsorb at the copper plating interface. This group includes polythylene diamine co-adipic acid, polyethylene glycol and polypropylene glycol. The unique characteristic of this group of water soluble polymers is their net positive charge in acidic solution and subsequent very strong adsorption at the copper cathode interface in the presence of previously adsorbed halide ions.