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Binder for Multilayer Ceramic Module Fabrication Disclosure Number: IPCOM000040665D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02

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Hunt, DJ Kim, J Knickerbocker, JM Park, JM Walker, GF [+details]


This article describes the use of polyethylenimine (PEI) as a binder for the formation of sintered ceramic substrates containing multilevel, interconnected thick film circuit patterns. PEI is soluble in water and allows good binder burn-out (low residual carbon level) in a nonoxidizing atmosphere, e.g., nitrogen, at a lower temperature than conventional polyvinylbutyral base binders. PEI, a nontoxic polymer, has excellent wetting characteristics for ceramic particles. Decomposition of PEI during burn-out is cleaner (less carbon residue) in an inert environment, e.g., nitrogen, than in an oxidizing environment. PEI molecular chains heated in an inert environment break every second monomeric unit, generating volatile piperazine.