Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
In electroplating baths, the problem of deposition defects in the form of increased roughness (nodules) or (pin)holes is examined by a plating apparatus arranged within a centrifuge. This plating apparatus makes visible with unprecedented precision how the plating quality is affected by such defects. In addition to a plurality of laboratory applications, the described plating apparatus is suitable for online bath characterization of, say, Cu pyro baths. In a laboratory centrifuge 1, two separate electrolytic plating cells 2, 3 are operated and contacted by slip rings 4, 5 connected to operating voltage V. Cathodes 6, 7 are respectively positioned at the inner and the outer end of the cells.