Frequency Controlled Copper Plating
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Electroplating systems that are current limited have plating rates that vary in relation to the distance from the electrodes. This presents a problem in those applications where sufficient plating is critical and the areas to be plated are remote, e.g., plating of high aspect ratio holes in printed circuit boards. The application of a frequency controlled rate to achieve more uniform plating is described in the following procedure.