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Metallurgical System for Gold to Tin or Solder Contacts

IP.com Disclosure Number: IPCOM000040789D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Sullivan, JF [+details]

Abstract

A metallurgical system is shown in the drawing in which tin or solder contacts gold plated leads in a plug-in connection or socket. A socket spring contact is plated with hard gold (knoop 200-225) and is 80-100 micro inches thick. The gold need not be pure - a purity level of 90% is acceptable. The gold is also smooth to 20 micro inches center line average. A barrier material of 100-125 micro inches of nickel separates the gold from the spring, which may be a copper alloy or any spring material. Only the contact area need be plated with gold and nickel. This is extremely cost effective.