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Modified Polyimide for Low End Packaging

IP.com Disclosure Number: IPCOM000040808D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Brady, MJ Duran, J Onoda, GY [+details]

Abstract

Polyimides are useful in packaging applications where multilayer structures are utilized. For example, polyimide is an electrically insulating layer between multiple layers of metallurgy. While polyimide is suitable for an intermediate layer in a structure, its low thermal conductivity makes it unsuitable as a top layer where it is subjected to heat when chips are softer bonded to the structure. In order to increase the thermal conductivity of polyimide without sacrificing its insulating properties, a particulate filler having a higher thermal conductivity and a lower electrical conductivity is incorporated into the polyimide. An example is boron nitride (BN).