In-Situ Method of Checking Strain of Wafers
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02
In thin film technology, it is desirable to be able to take data on a wafer while in a vacuum, in order to check wafer strain and to check the uniformity of thin films being deposited on the wafer. In the technique of this article, a scanning light beam is used.