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Essentially debris free etching in polyimide is possible without enclosing the specimen in a vacuum chamber. Successful laser ablation experiments were carried out at both 248 nm and 308 nm.
English (United States)
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Debris Free Polymer Laser Etching
Essentially debris free etching in polyimide is possible without enclosing the
specimen in a vacuum chamber. Successful laser ablation experiments were
carried out at both 248 nm and 308 nm.
Etching under a flow of trichlorotrifluoroethane extinguished the plume and
carried away the debris. This system also provided a self-disposing system for
the liquid as well as leaving no residue on the substrate.
If the material is vertically mounted, the debris is carried away with the aid of
Trichlorotrifluoroethane evaporates rapidly. By elevating the temperature of
the sample slightly, the evaporation time reduces to a negligible amount. The
exhaust needed for airborne debris and liberated gas in the original configuration
serves as exhaust for the vapors produced by the chemical.
When a fine spray of C2C13F3 is applied to the specimen during etching, the
usual plume extinguishes. Microscopic investigation reveals clean etching is
As to other liquids, a spray of deionized water also extinguishes the plume
and produces debris free etching in the proximity of the etched feature, but the
debris settles in a location Z 1 mm away from the etched feature. The remaining
liquid is a problem since it does not evaporate readily.
A cleaning solvent (containing C2C13F3) performs as well as the
trichlorotrifluoroethane except that some residue appears on the sample after
evaporation of the solvent.