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Glycerol Solder Flux

IP.com Disclosure Number: IPCOM000040821D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Ainslie, NG Brusic, VA Mitchell, KR Rohr, RL Shi, L [+details]

Abstract

Glycerol promotes solder reflow at low temperatures of less than 215oC and eliminates the possibility of subsequent corrosion due to chemical reaction.