Browse Prior Art Database

Diffusion Bonding

IP.com Disclosure Number: IPCOM000040823D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Andreshak, J Chalco, PA [+details]

Abstract

Lead attachment is accomplished simply and reliably by diffusion bonding of copper to copper without need of solder.