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Lead attachment is accomplished simply and reliably by diffusion bonding of copper to copper without need of solder.
English (United States)
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Lead attachment is accomplished simply and reliably by diffusion bonding of
copper to copper without need of solder.
In the figure, component 1 having copper leads 2 is positioned by pick-and-
place tool 3 so that leads 2 are placed on corresponding copper pads 4 of circuit
board 5. Tool 3 carries multiple pressure tips 6, each coincident with a lead 2.
The tips are suitably heated by pulsing or laser to above 0.5 Tm where Tm is the
absolute melting temperature of the metal. For copper, 0.5 Tm is approximately
400oC. The leads are compressed on their mating pads by tips 6 at
approximately the yield strength of copper or between 5,000 and 10,000 psi. For
a contact diameter of 0.006 in. the tip pressure is about 100 grams. This
technique lends itself to bonding simultaneously on opposite sides of a board and
to a wide range of lead spacings.