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Beam Deposited Patterned Seeding Layer

IP.com Disclosure Number: IPCOM000040824D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Gupta, A Sausa, RC White, JR [+details]

Abstract

A patterned seeding layer for electroless plating can be formed by decomposition of an organometallic ink with a high energy beam.