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A patterned seeding layer for electroless plating can be formed by decomposition of an organometallic ink with a high energy beam.
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Beam Deposited Patterned Seeding Layer
A patterned seeding layer for electroless plating can be formed by
decomposition of an organometallic ink with a high energy beam.
An organometallic electrochemically active film, such as a platinum resinate,
is deposited as a thin film on a substrate. A high energy beam, e.g., a laser, is
directed over the film in a desired pattern by scanning the laser or the substrate
to produce selective decomposition of the film and deposit a metal coating.
Patterned deposition can also be achieved by using a mask. The unreacted film
is removed and the substrate is placed in an electroless plating bath, such as
copper. The organometallic film can include an adhesion promoting compound,
if desired. Substrate materials may be either polymeric or ceramic.