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Improved Metal Adhesion to Polyimide

IP.com Disclosure Number: IPCOM000040838D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Skarvinko, EP Weale, RD [+details]

Abstract

A method of increasing the adhesion of thin film metallurgies, comprising successive layers of chromium (Cr), copper (Cu), and chromium (Cr), to polyimide substrates permits the design of ultra fine line circuitry. The method is described in the following.