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Multi-Level Chip Carrier using Silylated Photoresist as Dielectric

IP.com Disclosure Number: IPCOM000040890D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Katyl, RH Stephanie, JG [+details]

Abstract

Dry film photoresist is used as the dielectric between the wiring layers of a multi level chip carrier in a metallized ceramic polyimide process. The photoresist acquires the capacity to withstand high temperatures required for solder attachment after it is silylated. The process works as follows.