Multi-Level Chip Carrier using Silylated Photoresist as Dielectric
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-02
Dry film photoresist is used as the dielectric between the wiring layers of a multi level chip carrier in a metallized ceramic polyimide process. The photoresist acquires the capacity to withstand high temperatures required for solder attachment after it is silylated. The process works as follows.