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Enhanced Dry Solder Wetting using Au/PtCoating Layer

IP.com Disclosure Number: IPCOM000040916D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Chang, CA Yeh, HL [+details]

Abstract

A thin film platinum layer can be incorporated between an anti- oxidant layer and a conducting layer in a solder profile to achieve excellent dry solder wetting.