Browse Prior Art Database

Enhanced Dry Solder Wetting using Au/PtCoating Layer Disclosure Number: IPCOM000040916D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue


Related People

Chang, CA Yeh, HL [+details]


A thin film platinum layer can be incorporated between an anti- oxidant layer and a conducting layer in a solder profile to achieve excellent dry solder wetting.