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A thin film platinum layer can be incorporated between an anti- oxidant layer and a conducting layer in a solder profile to achieve excellent dry solder wetting.
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Enhanced Dry Solder Wetting using Au/PtCoating Layer
A thin film platinum layer can be incorporated between an anti- oxidant layer
and a conducting layer in a solder profile to achieve excellent dry solder wetting.
In dry solder wetting, a coating metal is used to protect the conducting layer
underneath the coating metal from reacting with air. For example, in dry
soldering with copper as the conducting layer, a gold/copper interface is used
wherein the gold layer is intended to prevent outdiffusion and subsequent
oxidation of the copper. However, these coating metals and gold, in particular
have been found to be less than acceptable as an oxidation and diffusion barrier.
Many metals are known to outdiffuse through the overcoating layer to the surface
and become oxidized, therefore preventing subsequent wetting and joining by
Such problems can be solved by incorporating a thin film platinum layer
between the anti-oxidant and conducting layer to achieve excellent dry solder
wetting. For example, a Au/Pt/Cu interface can be formed wherein there is only
interdiffusion between copper and platinum and there is no outdiffusion of copper
to the gold surface. The Au/Pt/Cu layers can be deposited by a variety of any
well known deposition techniques wherein the thickness of the layers are equal
and between 1000-2000Ao each.