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Dual-Dielectric Fabrication Method

IP.com Disclosure Number: IPCOM000040919D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Jacobs, SL Kaufman, FB Rothman, LB [+details]

Abstract

Photoresist hardening enables more efficient construction of multi-level metal structures using the polyimide planar process by filling gaps and serving as a dielectric and etch stop.