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Rare earth metals are dry etched with improved edge definition and little degradation of film quality by using a plasma-induced coating to produce the etching mask.
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Plasma Induced Masking
Rare earth metals are dry etched with improved edge definition and little
degradation of film quality by using a plasma-induced coating to produce the
A silicon wafer is blanketed with a coating of rare earth metals, such as
gadolinium and cobalt, by electron beam deposition. Photoresist is spin coated,
exposed and developed on the evaporated metals. The prepared wafer is
subjected to plasma etching in a barrel reactor with a gas mixture of carbon
tetrafluoride and oxygen (8.5%). This forms and grows a fluorocarbon- like film
on the exposed metal pattern. The resist stencil is then removed and the rare
earth film is sputter etched in argon. Thereafter, the protective flurocarbon-like
film is removed.