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Fig. 1 illustrates a low cost high lead count TAB package in which the chip backside is in contact with metal to dissipate heat from the chip and act as a ground plane to control electrical noise.
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Chip Embedded Tape Automated Bonding (TAB) Process
Fig. 1 illustrates a low cost high lead count TAB package in which the chip
backside is in contact with metal to dissipate heat from the chip and act as a
ground plane to control electrical noise.
In Fig. 1, a stainless steel base up to 1 foot wide is used to spin on polyimide
or other dielectric materials to which a top circuit layer is added by a fast plating
drum technology. This is done in a continuous flow manufacturing process, roll-
to-roll. The polyimide can subsequently be etched to hold a semi-conducted chip
in a packet as shown in Fig. 1. Sprocket holes are etched at the same time.
This permits subsequent manufacturing process controls. Drums can be used to
print circuit images onto the surface by fast plating process. This process
transfers the resulting metal image e.g., copper, to the top layer of the structure.
This process is used for very fine line patterns.
Once the TAB circuits are positioned with cantelever leads over edges of the
chip, connection to the chip can be accomplished by known means such as
soldering or thermal compressionbond.