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Chip Embedded Tape Automated Bonding (TAB) Process

IP.com Disclosure Number: IPCOM000040933D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Lord, PA [+details]

Abstract

Fig. 1 illustrates a low cost high lead count TAB package in which the chip backside is in contact with metal to dissipate heat from the chip and act as a ground plane to control electrical noise.