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Immersion Gold Plating for Flex Circuits

IP.com Disclosure Number: IPCOM000040943D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Albrechta, S Ballard, G Clementi, R Sambucetti, C Skarvinko, E Tonsi, N [+details]

Abstract

In the fabrication of printed circuits on organic films (polyimide) copper pads are provided for attachment of a semiconductor chip, or other such electronic device. It is important to prevent the oxidation of the copper pads on these polyimide film chip carriers (PFCC) before chip joining. A autocatalytic metal coating process which uses immersion gold to protect the copper pads is described in the following.