Immersion Gold Plating for Flex Circuits
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02
In the fabrication of printed circuits on organic films (polyimide) copper pads are provided for attachment of a semiconductor chip, or other such electronic device. It is important to prevent the oxidation of the copper pads on these polyimide film chip carriers (PFCC) before chip joining. A autocatalytic metal coating process which uses immersion gold to protect the copper pads is described in the following.