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Enhanced Pre-Metal Clean

IP.com Disclosure Number: IPCOM000040958D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Houston, GW Kelly, KA Pickens, MW [+details]

Abstract

Surfactants in low concentrations are typically used in cleaning solutions to improve the wettability of substrate surfaces prior to deposition of metal lines. It has been found that at concentrations much higher than normally used for pre-metal clean, a reduction in "scumming" or coagulation of chemicals that normally occurs after pre-metal etch results. This leads to greater circuit reliability and improved metal coverage.