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Evaporative Cooling Structure with Extended Surface Intermeshedwith Wicking Material Producing a Heat Pipe Effect Disclosure Number: IPCOM000040961D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02

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Chu, RC [+details]


Heat producing circuit devices such as transistors are cooled by heat transfer through a metal structure such as an enclosure or a heat sink. A wicking material is located on the outer surface of the metal structure. A dielectric liquid is distributed through the wicking material by capillary action, and the metal structure is cooled as the liquid evaporates from the surface. The metal structure is shaped to have an extended surface in contact with the wicking material.