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Slurry Dispensing Channel for Disk Substrate Polisher Disclosure Number: IPCOM000040978D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02

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Related People

Anger, F Escobedo, WJ [+details]


As shown in Figs. 1 and 2, the slurry for polishing the surfaces of disk substrates is dispensed from a slurry dispensing nozzle into a ring-shaped channel having a plurality of openings in its bottom. The channel is attached to the outer perimeter of the top polish pad ring. As the channel rotates with the top polish pad ring, slurry is dispensed from the nozzle into the channel around the entire circumference of the channel. The slurry then passes through the holes in the bottom of the channel and onto the disk substrates. During the rinse cycle water is dispensed from the nozzle and into the channel to clean the channel and the disk substrates. In this manner the slurry and rinse water is carried to all of the substrates simultaneously.