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Substrate Exposure Tooling Fixture

IP.com Disclosure Number: IPCOM000040980D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Jones, JR [+details]

Abstract

In the manufacture of thin films on substrates it is often necessary to use photoresist materials and masks. On occasion the photoresist material can become deposited on areas of the substrate where, if it is not removed, it will create problems during subsequent processes. At present, this excess photoresist is often removed by hand. The need for hand removal of excess photoresist can be avoided by providing a masking assembly in which all areas of the substrate are exposed to radiation except where the photoresist material is masked.