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Hermetic Packaging of J-Wire Leadframes Wire Bonded to Semi-conductor Chips Having a Central Array of Contacts

IP.com Disclosure Number: IPCOM000041000D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Chickanosky, JJ [+details]

Abstract

A ceramic spacer is employed to achieve short wire bond length from chip contacts to leadframe fingers in a glass sealed her-metic ceramic package. This method allows hermetic packaging with wire bonding of chips to a J-wire leadframe, though the chips with central contacts were designed for solder reflow packaging.