Hermetic Packaging of J-Wire Leadframes Wire Bonded to Semi-conductor Chips Having a Central Array of Contacts
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02
A ceramic spacer is employed to achieve short wire bond length from chip contacts to leadframe fingers in a glass sealed her-metic ceramic package. This method allows hermetic packaging with wire bonding of chips to a J-wire leadframe, though the chips with central contacts were designed for solder reflow packaging.