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Bulge Cap for a Semiconductor Substrate

IP.com Disclosure Number: IPCOM000041008D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02

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Mendelson, R Russotti, S [+details]


A bulge cap design for semiconductor substrates which prevents liquid encapsulant from being pulled into the active device region and creating a reliability concern is reported.