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A bulge cap design for semiconductor substrates which prevents liquid encapsulant from being pulled into the active device region and creating a reliability concern is reported.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
90% of the total text.
Page 1 of 1
Bulge Cap for a Semiconductor Substrate
A bulge cap design for semiconductor substrates which prevents liquid
encapsulant from being pulled into the active device region and creating a
reliability concern is reported.
A conventional module cap has straight sides, as shown in Fig. 1. When a
semiconductor substrate is inserted into a cap, standoff pads provide a
mechanism for insuring that proper spacing is maintained between the top of the
cap and the sub- strate. Module designs require a tight substrate to cap edge fit
to contain an environmental back seal. When a liquid encapsulant is used as a
back seal, capillary action can pull the excess sealant into the region of the active
device, causing reliability concerns. Module reliability is especially reduced below
an acceptable level if sufficient sealant is pulled into the region and forces its way
under the active device, interfering with the chip's interconnection means.
By redesigning the module cap to include a bulge on the sidewalls, as shown
in Fig. 2, the capillary force that pulls encapsulant into the active device region is
eliminated. The cap is designed with an outward bulge which starts moving
outwardly one-half the distance up the substrate sidewall. This allows a tight cap
to substrate fit on the four edges while eliminating the driving force which pulls
encapsulant into the region of the active device. The bulge design traps any
encapsulant pulled into the interior of the cap and prevents it from r...