Browse Prior Art Database

Single Layer Resist Enahnced Reflow Process that Produces Resist Undercutting Suitable for Metal Lift-off

IP.com Disclosure Number: IPCOM000041021D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Houston, GW Houston, TG Ng, HY [+details]

Abstract

Photoresist structures for lift-off processes require that there be some overhang to allow metal lift-off. This article discloses an additional process step which improves the metal lift-off profile in a photoresist layer.