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Complete Printed Circuit Wafer Probe

IP.com Disclosure Number: IPCOM000041022D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Williams, KH [+details]

Abstract

This disclosure describes a wafer probe capable of contacting all the pads on a wafer at the same time. The ability to contact all pads of a wafer at one time decreases the test time by avoidingmechanical stepping and also results in being able to burn-in at the wafer level.