Complete Printed Circuit Wafer Probe
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02
This disclosure describes a wafer probe capable of contacting all the pads on a wafer at the same time. The ability to contact all pads of a wafer at one time decreases the test time by avoidingmechanical stepping and also results in being able to burn-in at the wafer level.