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Elimination of Wafer-Edge Photoresist Contamination

IP.com Disclosure Number: IPCOM000041025D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Bryson, CC Hume, JB [+details]

Abstract

This article describes a simple means for reducing the formation of resist flakes or nubs on the edge of semiconductor wafers during photoresist application. Nubs are a major yield detractor and adversely affect the focus of photolithographic images.