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Enhanced Lift-Off Structure for Multi-Layer Resist (mlr)

IP.com Disclosure Number: IPCOM000041061D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-02

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Chung, MB Ebel, CJ Weissberg, AS [+details]


This article describes a method for enhancing the lift-off of evaporated metal by reducing processing time and eliminating the problem of residual metal and photoresist material.