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Extension of Surface Mount Multilayer Substrate to Accept Pinned Modules

IP.com Disclosure Number: IPCOM000041063D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-02

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Schrottke, G [+details]


Present technology exists to accomplish multilayer, high performance substrates and cards, using flex-type materials such as polyimides. These technologies can be used to manufacture cards for electronic assemblies that accept any of the various surface mount packages that are available in the industry. Unfortunately, drilling these cards to accept pin-thru-hole modules cannot be done easily, or destroys the advantage of the multilayer structure.