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Closely spaced contact terminals on devices such as multilayer ceramic capacitors are readily formed by sawing a series of grooves in the metallization layers on the device.
English (United States)
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Method to Produce Closely Spaced Termination Bumps by Sawing
Closely spaced contact terminals on devices such as multilayer ceramic
capacitors are readily formed by sawing a series of grooves in the metallization
layers on the device.
Referring to the drawing, several layers of metallization are applied to a
capacitor body 1. A first conductive layer 2 adheres to the body 1. Then a solder
wettable layer 3, and finally a solder layer 4, are applied. Each layer is formed of
multiple layers of compatible metals.
Three sets of grooves 5, 6, and 7 are then formed in the conductive layers by
sawing to form an array of octagonal bumps 8. These grooves extend through
the solder layer 4 and solder wettable layer 3, but not through the first layer 2. A
fourth set of grooves 9 extends through first conductive layer 2 and into body 1.
Grooves 9 are formed to provide electrical isolation between sets of termination
bumps 8. Each set of isolated bumps 8 provides electrical connection to
selected capacitor plates previously formed in the capacitor body 1. Additional
isolation grooves 9 may be formed to provide different termination bump