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This article relates generally to selective etching processes for metal and more particularly relates to a method for etching sputtered or evaporated films of gold, copper and silver.
English (United States)
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Ultra Fast Etchant for Gold, Copper And Silver Films
This article relates generally to selective etching processes for metal and
more particularly relates to a method for etching sputtered or evaporated films of
gold, copper and silver.
After a sputtered or evaporated film of copper, gold or silver is prepared, it
may be suitably masked for a subsequent +etching step. An etching solution (~
50%) of Iodine (I2) in N-methyl pyrrolidone (NMP) is prepared. The evaporated
or sputtered film of copper, gold or silver is then exposed at ambient for 10-15
seconds to a spray or solution of the above etchant to remove one micron of the
film. The remaining material is then rinsed in a suitable solvent such as
methanol hydroxide (MeOH).
The above described process is extremely fast and is selective in that it
doesn't attack other metals such as palladium, chromium, aluminum, etc. In
addition, no alkali metal residues are left on the substrate surfaces.