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Application of Low Silver Loading Conductive Adhesives to Surface Mounting

IP.com Disclosure Number: IPCOM000041143D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue


Related People

Huang, WS Park, JM Shi, L Ting, CY [+details]


Conductive Adhesives with A Low Silver Content (less than 65%) can be used to surface mount components to printed circuit boards.