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Conductive Adhesives with A Low Silver Content (less than 65%) can be used to surface mount components to printed circuit boards.
English (United States)
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Application of Low Silver Loading Conductive Adhesives to Surface
Conductive Adhesives with A Low Silver Content (less than 65%) can be
used to surface mount components to printed circuit boards.
Silver powders spherical particles of size approximately 5-8 microns are
homogeneously dispersed in a quantity of an epoxy adhesive with about 4% of a
catalyst present. This conductive adhesive mixture is then dispersed onto
copper pads of the printed circuit boards which is then cured for 15-20 minutes at
85-95oC. Leads of the chips are then pressed through the top of the pad to the
bottom. The populated printed circuit board assembly is then re-heated to
complete curing of the adhesive.
High conductivity has been found to occur using low percentage content
silver adhesives according to the above process.