Complete Module Ceramic Circuitized Cap
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
This article describes the use of the underside (inside) area of a non-metallic cap (cover) of a semiconductor device for circuitry or for component placement, thereby increasing the density without increasing the real estate. The underside of the cap can have circuitry etched into or deposited onto it and can include active devices, passive devices, semiconductor chips, etc. After proper surface preparation, conventional processes can be used for the formation and attachment of the circuit and components.