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Improvements to semiconductor wafer carriers can facilitate their handling both manually and automatically, as well as to provide a reduction in tolerance accumulations.
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Pickup Tabs And Horizontal Detents for Wafer Carriers
Improvements to semiconductor wafer carriers can facilitate their handling
both manually and automatically, as well as to provide a reduction in tolerance
The first modification to the wafer carrier 1 would be to add pickup tabs 2 on
both ends of the carrier plus the addition of pickup tabs 3 on both sides of the
carrier. By extending the tab details to both side walls as well as the end and H-
bar ends, pickup is provided from any of the four surfaces. The dimensional
details are identical so the same handling mechanism may be utilized. This
method is especially suited to automatic operations.
The second method works to avoid the effects of deformation of plastic
carriers. This causes differences in the wafer datum line when used with
automatic handling methods. The tolerances on commercial wafer carriers are
excessive due to accumulated tolerances and flexing of the carrier because the
datum line is taken from the lower part of the carrier.
The proposal suggests that a locating detent 4 be placed on both sides of the
carrier 1 at the 13th slot 5 of the 25-slot carrier. As an alternative, a reference pin
6 may be used. The relocating of the datum point in this manner means the
tolerance accumulation will be significantly lessened.