High Conductivity Heatsink for TAB, SMT, And Other Electronic Devices
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02
Synthetic diamond layer sandwiched between an electronic package heatsink and a semiconductor chip substantially lowers thermal contact resistance therebetween. Coating a heatsink with synthetic diamond substantially enhances spread of heat throughout the heatsink, thereby increasing heatsink efficiency. The synthetic diamond layer serves as a diffusion barrier to residual or airborne contaminants at the chip surface and as a radiation protective layer if the chip surface is coated with the synthetic diamond.