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High Conductivity Heatsink for TAB, SMT, And Other Electronic Devices

IP.com Disclosure Number: IPCOM000041199D
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02

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Mok, LS Noyan, IC [+details]


Synthetic diamond layer sandwiched between an electronic package heatsink and a semiconductor chip substantially lowers thermal contact resistance therebetween. Coating a heatsink with synthetic diamond substantially enhances spread of heat throughout the heatsink, thereby increasing heatsink efficiency. The synthetic diamond layer serves as a diffusion barrier to residual or airborne contaminants at the chip surface and as a radiation protective layer if the chip surface is coated with the synthetic diamond.