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A photoresist process normally used for the formation of lift-off patterns is used to guide the growth of electroplated metal. This will define the shape of the deposited metal.
English (United States)
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Process for Making Electroplated Metal Lines With Controlled Edge Slope
A photoresist process normally used for the formation of lift-off patterns is
used to guide the growth of electroplated metal. This will define the shape of the
Referring to Fig. 1, photresist 2 is applied over a thin conductive layer 4
formed on insulating substrate 6. Photoresist 2 is exposed and developed to
define a resist pattern having undercut edges.
Fig. 2 shows the results of electroplating metal 8 onto the exposed portion of
conductive layer 4 to nearly fill the opening in photoresist 2.
Fig. 3 shows the cross-section of metal line 8 after removal of photoresist 2
and all of conductive film 4 not covered by electropated film 8.
Thus, a metal line is formed having edges sloped to be compatible with
subsequent insulating film deposition, that is, a slope that avoids the danger of
unfilled crevices at line edges, such as can occur when line edges are vertical or