Browse Prior Art Database

Conductive Grid/3d Moldings

IP.com Disclosure Number: IPCOM000041228D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Cook, LG Uberbacher, G Walsh, TJ [+details]

Abstract

Electrostatic build-up over time can cause product break-down when a product is stored or transported in molded plastic carriers or containers equipped with clear windows. This article concerns the employment of conductive film and grid combination affixed to the container window so as to assure both a consistent electrostatic decay (ESD) rate and adequate transparency for visual identification of the contents.