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Method of Selectively Copper Plating Molybdenum Structures on Multilayer Ceramic Substrates Disclosure Number: IPCOM000041316D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02

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Bayer, T Junginger, R Kuenzel, U Schaefer, R [+details]


A method is proposed, by means of which metal structures arranged on or embedded in an isolating material can be selectively copper plated. A copper salt solution, in which the copper ion is preferably present in a complex form, is applied to the structure to be copper plated, using a high-voltage (Tesla, corona) discharge. For this purpose, a Tesla electrode, applied outside the solution in the vicinity of the structure to be metallized, is ignited. A counter electrode is not required. In another arrangement, the Tesla electrode is immersed in the copper salt solution, and the structure to be copper plated is connected to ground potential. In the illustrated embodiment, the Tesla electrode is contacted at the molybdenum conductors of a multilayer ceramic (MLC) substrate which are not immersed in the solution.