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Magnetic Bubble Module Thermal Enhancement Using a Magnetic Fluid With Filter

IP.com Disclosure Number: IPCOM000041391D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Belser, KA [+details]

Abstract

A bubble module 10 has a magnetic housing structure 12, magnets 14 and ferrite faceplates 16. Copper coils 18A and 18B are separated from the ferrite faceplates 16 by a gap 20. The gap 20, when filled with air, results in an undesirable large thermal resistance across the gap. However, when the gap 20 is filled with a magnetic fluid of the type described in U.S. Patent 4,293,137 having a thermal conductivity of 0.131 BTU/HrÅ’Fft (compared to 0.01627 for air), the thermal conductivity is increased by a factor of 8, which substantially enhances the thermal characteristics of the module 10.