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Pin-Brazing Apparatus With Thermal Gas Pin-Preloading System

IP.com Disclosure Number: IPCOM000041432D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Balder, WB Driscoll, RG [+details]

Abstract

This pin-brazing apparatus includes a pin-preloading system that utilizes gas expansion to form the pin against the substrate. I/O pins are normally brazed to semiconductor package substrates, particularly multilayer ceramic substrates. The pins are positioned in a brazing boat and forced against the substrate by weights located above the pins. The assembly is put through the brazing furnace which melts the brazing material and secures the pins in place. The weights, however, must be very large when the pin-preloading force is high. This weight mass must be heated along with the pins, which places a burden on the furnace and extends the length of the brazing cycle. In the apparatus shown in Fig. 1, the pins 10, positioned in brazing boat 12, are maintained in position with respect to substrate 14.