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Hand-Held Wafer-Handling Tool

IP.com Disclosure Number: IPCOM000041464D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02

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Miklos, MJ [+details]


Modern plasma tools for dry etching presently use recessed pockets located on electrode plates in which the wafers to be processed are placed. Existing tools and methods of removing such processed wafers from the pockets can result in damage to the wafers and the plate surface, and can lead to contamination problems. To avoid these problems, the so-called bugle tip suction pick-up tool which picks up wafer's when activated over a wafers edge where the area free of chip design is located, has been used. This tool also has a shortcoming in that it is unable to safely hold the wafer during its transportation. Since the wafer is being held by only a single point, permitting the outer edge of the wafer to fall off resulting in breakage or rotational or shifting problems.