Browse Prior Art Database

CONTACT TRANSFER FLUX APPLICATOR

IP.com Disclosure Number: IPCOM000041540D
Original Publication Date: 1984-Feb-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Geany, GM Perlini, JJ Scarafino, AJ Wille, R [+details]

Abstract

It is important that a selective amount of flux be placed at the appropriate MLC (multilayer ceramic) substrate chip sites. In the past this has been accomplished by using time pressure methods through screens, masks or an orifice, or by the most basic way of applying the flux by hand. Fig. 1 shows a schematic diagram of the flux applicator system. The flux is pumped from the reservoir 10 to the platen 12 surface. A doctor blade 13 wipes the top surface of the platen 12, leaving the desired film thickness of flux thereon. Transfer head 11 is arranged to move in the downward direction until the transfer probes 14 contact the platen 12, allowing flux to fill the probe cavities. The head 11 is retracted and moved horizontally to the correct position over the chip site on the substrate 16 (Fig. 4).