High Performance Chip-Cooling Technique for Cold Plate or External Air-Cooled Modules
Original Publication Date: 1984-Feb-01
Included in the Prior Art Database: 2005-Feb-02
This article describes modifications to finned cooled modules such as those described in [1,2,3]. The disclosed technique comprises a finned device using OSTALLOY* at the contacting chip interface and an extended surface area with respect to the hat interface region. The arrangement produces low thermal resistance at the chip contact due to the OSTALLOY, and a low thermal resistance at the hat due to the increased surface area. In one version, the device is loaded by a single spring which also acts to contain it at a given lateral position in the hat. In addition, a spring-loaded elastomer material is used for shock-absorption purposes. In a second version, the spring is not used and the spring-loaded elastomer is used instead for both the loading and shock-absorption purposes.